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INTEL and NANOTECH Sign Agreement for 200MM Manufacturing Process and Equipment







INTEL and NANOTECH Sign Agreement for
200MM Manufacturing Process and
Equipment

INTEL and NANOTECH Sign Agreement for
200MM Manufacturing Process and
Equipment
06/19/2004 02:58 AM

Nanotech Corporation and Intel Corporation today announced an agreement whereby Intel will provide manufacturing process technology and equipment for first phase of Nanotech’s proposed wafer fabrication facility in Changzhou National Hi-Tech District, Changzhou, Jiangsu Province, China. [PRWEB Jun 19, 2004]




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